Interface dynamics for copper electrodeposition: The role of organic additives in the growth mode
An atomistic model for Cu electrodeposition under nonequilibrium conditions is presented. Cu electrodeposition takes place with a height-dependent deposition rate that accounts for fluctuations in the local [formula presented] ions concentration at the interface, followed by surface diffusion. This...
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2002
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Acceso en línea: | http://hdl.handle.net/20.500.12110/paper_1063651X_v66_n4_p4_DeLeon |
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paperaa:paper_1063651X_v66_n4_p4_DeLeon2023-06-12T16:49:18Z Interface dynamics for copper electrodeposition: The role of organic additives in the growth mode Phys Rev E. 2002;66(4):4 De Leon, P.F.J. Albano, E.V. Salvarezza, R.C. Solari, H.G. Additives Chemical vapor deposition Computer simulation Copper Diffusion Electrodeposition Interfaces (materials) Ions Mass transfer Mathematical models Monolayers Probability Surface roughness Atomistic model Edwards-Wilkinson equation Energy barriers Growth dynamics Surface chemistry article An atomistic model for Cu electrodeposition under nonequilibrium conditions is presented. Cu electrodeposition takes place with a height-dependent deposition rate that accounts for fluctuations in the local [formula presented] ions concentration at the interface, followed by surface diffusion. This model leads to an unstable interface with the development of protrusions and grooves. Subsequently the model is extended to account for the presence of organic additives, which compete with [formula presented] for adsorption at protrusions, leading to a stable interface with scaling exponents consistent with those of the Edwards-Wilkinson equation. The model reproduces the interface evolution experimentally observed for Cu electrodeposition in the absence and in the presence of organic additives. © 2002 The American Physical Society. Fil:Solari, H.G. Universidad de Buenos Aires. Facultad de Ciencias Exactas y Naturales; Argentina. 2002 info:eu-repo/semantics/article info:ar-repo/semantics/artículo info:eu-repo/semantics/publishedVersion application/pdf eng info:eu-repo/semantics/openAccess http://creativecommons.org/licenses/by/2.5/ar http://hdl.handle.net/20.500.12110/paper_1063651X_v66_n4_p4_DeLeon |
institution |
Universidad de Buenos Aires |
institution_str |
I-28 |
repository_str |
R-134 |
collection |
Biblioteca Digital - Facultad de Ciencias Exactas y Naturales (UBA) |
language |
Inglés |
orig_language_str_mv |
eng |
topic |
Additives Chemical vapor deposition Computer simulation Copper Diffusion Electrodeposition Interfaces (materials) Ions Mass transfer Mathematical models Monolayers Probability Surface roughness Atomistic model Edwards-Wilkinson equation Energy barriers Growth dynamics Surface chemistry article |
spellingShingle |
Additives Chemical vapor deposition Computer simulation Copper Diffusion Electrodeposition Interfaces (materials) Ions Mass transfer Mathematical models Monolayers Probability Surface roughness Atomistic model Edwards-Wilkinson equation Energy barriers Growth dynamics Surface chemistry article De Leon, P.F.J. Albano, E.V. Salvarezza, R.C. Solari, H.G. Interface dynamics for copper electrodeposition: The role of organic additives in the growth mode |
topic_facet |
Additives Chemical vapor deposition Computer simulation Copper Diffusion Electrodeposition Interfaces (materials) Ions Mass transfer Mathematical models Monolayers Probability Surface roughness Atomistic model Edwards-Wilkinson equation Energy barriers Growth dynamics Surface chemistry article |
description |
An atomistic model for Cu electrodeposition under nonequilibrium conditions is presented. Cu electrodeposition takes place with a height-dependent deposition rate that accounts for fluctuations in the local [formula presented] ions concentration at the interface, followed by surface diffusion. This model leads to an unstable interface with the development of protrusions and grooves. Subsequently the model is extended to account for the presence of organic additives, which compete with [formula presented] for adsorption at protrusions, leading to a stable interface with scaling exponents consistent with those of the Edwards-Wilkinson equation. The model reproduces the interface evolution experimentally observed for Cu electrodeposition in the absence and in the presence of organic additives. © 2002 The American Physical Society. |
format |
Artículo Artículo publishedVersion |
author |
De Leon, P.F.J. Albano, E.V. Salvarezza, R.C. Solari, H.G. |
author_facet |
De Leon, P.F.J. Albano, E.V. Salvarezza, R.C. Solari, H.G. |
author_sort |
De Leon, P.F.J. |
title |
Interface dynamics for copper electrodeposition: The role of organic additives in the growth mode |
title_short |
Interface dynamics for copper electrodeposition: The role of organic additives in the growth mode |
title_full |
Interface dynamics for copper electrodeposition: The role of organic additives in the growth mode |
title_fullStr |
Interface dynamics for copper electrodeposition: The role of organic additives in the growth mode |
title_full_unstemmed |
Interface dynamics for copper electrodeposition: The role of organic additives in the growth mode |
title_sort |
interface dynamics for copper electrodeposition: the role of organic additives in the growth mode |
publishDate |
2002 |
url |
http://hdl.handle.net/20.500.12110/paper_1063651X_v66_n4_p4_DeLeon |
work_keys_str_mv |
AT deleonpfj interfacedynamicsforcopperelectrodepositiontheroleoforganicadditivesinthegrowthmode AT albanoev interfacedynamicsforcopperelectrodepositiontheroleoforganicadditivesinthegrowthmode AT salvarezzarc interfacedynamicsforcopperelectrodepositiontheroleoforganicadditivesinthegrowthmode AT solarihg interfacedynamicsforcopperelectrodepositiontheroleoforganicadditivesinthegrowthmode |
_version_ |
1769810038406250496 |