New thermal and rheological approaches of chickpea–wheat dough for breadmaking

Chickpea (Cicer arietinum L.) is a legume of Fabaceae family whose grains are rich in proteins, total dietary fiber, unsaturated lipids, minerals and bioactive compounds with antioxidant activity. Therefore, chickpea flour can be an attractive high nutritional complement to wheat flour for the formu...

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Autores principales: Bigne, Facundo, Romero, Alberto, Ferrero, Cristina, Puppo, María Cecilia, Guerrero, Antonio
Formato: Articulo
Lenguaje:Inglés
Publicado: 2021
Materias:
Química
Wheat
Chickpea
Rheology
Microstructure
Thermal properties
Acceso en línea:http://sedici.unlp.edu.ar/handle/10915/146371
Aporte de:
SEDICI (UNLP) de Universidad Nacional de La Plata
id I19-R120-10915-146371
record_format dspace
institution Universidad Nacional de La Plata
institution_str I-19
repository_str R-120
collection SEDICI (UNLP)
language Inglés
topic Química
Wheat
Chickpea
Rheology
Microstructure
Thermal properties
spellingShingle Química
Wheat
Chickpea
Rheology
Microstructure
Thermal properties
Bigne, Facundo
Romero, Alberto
Ferrero, Cristina
Puppo, María Cecilia
Guerrero, Antonio
New thermal and rheological approaches of chickpea–wheat dough for breadmaking
topic_facet Química
Wheat
Chickpea
Rheology
Microstructure
Thermal properties
description Chickpea (Cicer arietinum L.) is a legume of Fabaceae family whose grains are rich in proteins, total dietary fiber, unsaturated lipids, minerals and bioactive compounds with antioxidant activity. Therefore, chickpea flour can be an attractive high nutritional complement to wheat flour for the formulation of composite breads. In the present study, the thermal and rheological characteristics of the chickpea–wheat dough obtained by replacement of wheat flour with 100 and 200 g/Kg of chickpea flour were assessed by Differential Scanning Calorimetry (DSC), Rapid Visco Analysis (RVA), Dynamic Mechanical Thermal Analysis (DMA) and Texture Profile Analysis (TPA). Higher gelatinization temperatures in coincidence with higher pasting temperatures with lower breakdown and setback of the pastes were obtained for the chickpea–wheat mixtures. Furthermore, the viscoelasticity of the wheat dough changed with the presence of chickpea flour, leading to higher dynamic moduli (E’, E’’) and lower values of tangent of the phase angle (tan δ = E’’/E’) suggesting the formation of a more elastic matrix. At higher deformations (TPA), higher values of hardness and elasticity were observed. These changes were associated with a marked disruption of the gluten network by the presence of certain chickpea components like proteins, assessed by different microscopic techniques.
format Articulo
Articulo
author Bigne, Facundo
Romero, Alberto
Ferrero, Cristina
Puppo, María Cecilia
Guerrero, Antonio
author_facet Bigne, Facundo
Romero, Alberto
Ferrero, Cristina
Puppo, María Cecilia
Guerrero, Antonio
author_sort Bigne, Facundo
title New thermal and rheological approaches of chickpea–wheat dough for breadmaking
title_short New thermal and rheological approaches of chickpea–wheat dough for breadmaking
title_full New thermal and rheological approaches of chickpea–wheat dough for breadmaking
title_fullStr New thermal and rheological approaches of chickpea–wheat dough for breadmaking
title_full_unstemmed New thermal and rheological approaches of chickpea–wheat dough for breadmaking
title_sort new thermal and rheological approaches of chickpea–wheat dough for breadmaking
publishDate 2021
url http://sedici.unlp.edu.ar/handle/10915/146371
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