Control of zinc plating solutions, determining the optimum concentration of thiourea additive by electrochemical techniques

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In this work we have analyzed the effect of thiourea concentration in the acid zinc deposition process. For these purpose, we have used the electrochemical techniques (cathodic voltammetry and Electrochemistry Impedance Spectroscopy, EIS). It allows determining the optimal concentration thiourea add...

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Autores principales: Mahmud, Z., Gordillo, G., Gassa, L., Ventura D'Alkaine, C.
Formato: Informe Técnico
Lenguaje:Ingles
Publicado: 2016
Materias:
zinc
electroplating
additives
EIS
Acceso en línea:http://hdl.handle.net/20.500.12110/technicalreport_n00014
Aporte de:
Biblioteca Digital - Facultad de Ciencias Exactas y Naturales (UBA) de Universidad de Buenos Aires
id todo:technicalreport_n00014
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spelling todo:technicalreport_n000142023-10-03T16:51:02Z Control of zinc plating solutions, determining the optimum concentration of thiourea additive by electrochemical techniques Mahmud, Z. Gordillo, G. Gassa, L. Ventura D'Alkaine, C. zinc electroplating additives EIS In this work we have analyzed the effect of thiourea concentration in the acid zinc deposition process. For these purpose, we have used the electrochemical techniques (cathodic voltammetry and Electrochemistry Impedance Spectroscopy, EIS). It allows determining the optimal concentration thiourea additive. In this range, we have obtained better finishes, more refined and decoratives layers. We have found in voltammetric studies that the electroreduction of Zn 2+ in the presence of thiourea is accelerated. The EIS studies has shown the “electrodeposition resistance” decrease in the presence of thiourea. The addition of more thiourea in the solution, in the optimum concentration, the electrodeposition resistance to the electrodeposition process is increased. The main contribution of this research and its scientific contribution is the use of electrochemical techniques for determining the optimal concentration of thiourea additive in the zinc electroplating solution in chloride acid media Fil: Mahmud, Z. Instituto Nacional de Tecnología Industrial. Procesos Superficiales; Argentina. Fil: Gordillo, G. Universidad de Buenos Aires. Facultad de Ciencias Exactas y Naturales. Departamento de Química Inorgánica, Analítica y Química Física; Argentina. Fil: Gassa, L. Universidad Nacional de La Plata. Facultad de Ciencias Exactas. Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas; Argentina. Fil: Ventura D'Alkaine, C. Universidade Federal de São Carlos; Brasil. 2016-09 Informe Técnico application/pdf Ingles info:eu-repo/semantics/openAccess http://creativecommons.org/licenses/by/2.5/ar http://hdl.handle.net/20.500.12110/technicalreport_n00014
institution Universidad de Buenos Aires
institution_str I-28
repository_str R-134
collection Biblioteca Digital - Facultad de Ciencias Exactas y Naturales (UBA)
language Ingles
orig_language_str_mv Ingles
topic zinc
electroplating
additives
EIS
spellingShingle zinc
electroplating
additives
EIS
Mahmud, Z.
Gordillo, G.
Gassa, L.
Ventura D'Alkaine, C.
Control of zinc plating solutions, determining the optimum concentration of thiourea additive by electrochemical techniques
topic_facet zinc
electroplating
additives
EIS
description In this work we have analyzed the effect of thiourea concentration in the acid zinc deposition process. For these purpose, we have used the electrochemical techniques (cathodic voltammetry and Electrochemistry Impedance Spectroscopy, EIS). It allows determining the optimal concentration thiourea additive. In this range, we have obtained better finishes, more refined and decoratives layers. We have found in voltammetric studies that the electroreduction of Zn 2+ in the presence of thiourea is accelerated. The EIS studies has shown the “electrodeposition resistance” decrease in the presence of thiourea. The addition of more thiourea in the solution, in the optimum concentration, the electrodeposition resistance to the electrodeposition process is increased. The main contribution of this research and its scientific contribution is the use of electrochemical techniques for determining the optimal concentration of thiourea additive in the zinc electroplating solution in chloride acid media
format Informe Técnico
author Mahmud, Z.
Gordillo, G.
Gassa, L.
Ventura D'Alkaine, C.
author_facet Mahmud, Z.
Gordillo, G.
Gassa, L.
Ventura D'Alkaine, C.
author_sort Mahmud, Z.
title Control of zinc plating solutions, determining the optimum concentration of thiourea additive by electrochemical techniques
title_short Control of zinc plating solutions, determining the optimum concentration of thiourea additive by electrochemical techniques
title_full Control of zinc plating solutions, determining the optimum concentration of thiourea additive by electrochemical techniques
title_fullStr Control of zinc plating solutions, determining the optimum concentration of thiourea additive by electrochemical techniques
title_full_unstemmed Control of zinc plating solutions, determining the optimum concentration of thiourea additive by electrochemical techniques
title_sort control of zinc plating solutions, determining the optimum concentration of thiourea additive by electrochemical techniques
publishDate 2016
url http://hdl.handle.net/20.500.12110/technicalreport_n00014
work_keys_str_mv AT mahmudz controlofzincplatingsolutionsdeterminingtheoptimumconcentrationofthioureaadditivebyelectrochemicaltechniques
AT gordillog controlofzincplatingsolutionsdeterminingtheoptimumconcentrationofthioureaadditivebyelectrochemicaltechniques
AT gassal controlofzincplatingsolutionsdeterminingtheoptimumconcentrationofthioureaadditivebyelectrochemicaltechniques
AT venturadalkainec controlofzincplatingsolutionsdeterminingtheoptimumconcentrationofthioureaadditivebyelectrochemicaltechniques
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