Interface dynamics for copper electrodeposition: The role of organic additives in the growth mode

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An atomistic model for Cu electrodeposition under nonequilibrium conditions is presented. Cu electrodeposition takes place with a height-dependent deposition rate that accounts for fluctuations in the local [formula presented] ions concentration at the interface, followed by surface diffusion. This...

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Detalles Bibliográficos
Autores principales:	De Leon, P.F.J., Albano, E.V., Salvarezza, R.C., Solari, H.G.
Formato:	JOUR
Materias:	Additives Chemical vapor deposition Computer simulation Copper Diffusion Electrodeposition Interfaces (materials) Ions Mass transfer Mathematical models Monolayers Probability Surface roughness Atomistic model Edwards-Wilkinson equation Energy barriers Growth dynamics Surface chemistry article
Acceso en línea:	http://hdl.handle.net/20.500.12110/paper_1063651X_v66_n4_p4_DeLeon
Aporte de:	Biblioteca Digital - Facultad de Ciencias Exactas y Naturales (UBA) de Universidad de Buenos Aires

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