Cita APA (7a ed.)

De Leon, P., Albano, E., Salvarezza, R., & Solari, H. (2002). Interface dynamics for copper electrodeposition: The role of organic additives in the growth mode.

Cita Chicago Style (17a ed.)

De Leon, P.F.J., E.V Albano, R.C Salvarezza, y H.G Solari. Interface Dynamics for Copper Electrodeposition: The Role of Organic Additives in the Growth Mode. 2002.

Cita MLA (8a ed.)

De Leon, P.F.J., et al. Interface Dynamics for Copper Electrodeposition: The Role of Organic Additives in the Growth Mode. 2002.