Validity of the linear growth equation for interface evolution for copper electrodeposition in the presence of organic additives
The interface evolution of copper electrodeposits produced on copper from a thiorea-derivative-containing acid plating bath at a low current density and 298 K was studied by atomic force microscopy (AFM). The dynamic scaling theory was applied to AFM images leading to scaling exponents, which are co...
Guardado en:
| Autores principales: | Vázquez, L., Salvarezza, Roberto Carlos, Arvia, Alejandro Jorge |
|---|---|
| Formato: | Articulo |
| Lenguaje: | Inglés |
| Publicado: |
1997
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| Materias: | |
| Acceso en línea: | http://sedici.unlp.edu.ar/handle/10915/86332 |
| Aporte de: |
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