Validity of the linear growth equation for interface evolution for copper electrodeposition in the presence of organic additives

The interface evolution of copper electrodeposits produced on copper from a thiorea-derivative-containing acid plating bath at a low current density and 298 K was studied by atomic force microscopy (AFM). The dynamic scaling theory was applied to AFM images leading to scaling exponents, which are co...

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Detalles Bibliográficos
Autores principales: Vázquez, L., Salvarezza, Roberto Carlos, Arvia, Alejandro Jorge
Formato: Articulo
Lenguaje:Inglés
Publicado: 1997
Materias:
Ciencias Exactas
Química
Cobre
electrodeposition
Tiourea
Microscopía de Fuerza Atómica
Modelo de crecimiento
Fractales
Acceso en línea:http://sedici.unlp.edu.ar/handle/10915/86332
Aporte de:
SEDICI (UNLP) de Universidad Nacional de La Plata
id I19-R120-10915-86332
record_format dspace
institution Universidad Nacional de La Plata
institution_str I-19
repository_str R-120
collection SEDICI (UNLP)
language Inglés
topic Ciencias Exactas
Química
Cobre
electrodeposition
Tiourea
Microscopía de Fuerza Atómica
Modelo de crecimiento
Fractales
spellingShingle Ciencias Exactas
Química
Cobre
electrodeposition
Tiourea
Microscopía de Fuerza Atómica
Modelo de crecimiento
Fractales
Vázquez, L.
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
Validity of the linear growth equation for interface evolution for copper electrodeposition in the presence of organic additives
topic_facet Ciencias Exactas
Química
Cobre
electrodeposition
Tiourea
Microscopía de Fuerza Atómica
Modelo de crecimiento
Fractales
description The interface evolution of copper electrodeposits produced on copper from a thiorea-derivative-containing acid plating bath at a low current density and 298 K was studied by atomic force microscopy (AFM). The dynamic scaling theory was applied to AFM images leading to scaling exponents, which are consistent with the predictions of the complete linear equation for interface growth. In agreement with the theory, experimental data show, for the interface evolution, a crossover from a surface diffusion controlled regime to an Edwards-Wilkinson regime as the length scale increases.
format Articulo
Articulo
author Vázquez, L.
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author_facet Vázquez, L.
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author_sort Vázquez, L.
title Validity of the linear growth equation for interface evolution for copper electrodeposition in the presence of organic additives
title_short Validity of the linear growth equation for interface evolution for copper electrodeposition in the presence of organic additives
title_full Validity of the linear growth equation for interface evolution for copper electrodeposition in the presence of organic additives
title_fullStr Validity of the linear growth equation for interface evolution for copper electrodeposition in the presence of organic additives
title_full_unstemmed Validity of the linear growth equation for interface evolution for copper electrodeposition in the presence of organic additives
title_sort validity of the linear growth equation for interface evolution for copper electrodeposition in the presence of organic additives
publishDate 1997
url http://sedici.unlp.edu.ar/handle/10915/86332
work_keys_str_mv AT vazquezl validityofthelineargrowthequationforinterfaceevolutionforcopperelectrodepositioninthepresenceoforganicadditives
AT salvarezzarobertocarlos validityofthelineargrowthequationforinterfaceevolutionforcopperelectrodepositioninthepresenceoforganicadditives
AT arviaalejandrojorge validityofthelineargrowthequationforinterfaceevolutionforcopperelectrodepositioninthepresenceoforganicadditives
bdutipo_str Repositorios
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