The behaviour of copper anodes in aqueous thiourea-containing sulphuric acid solutions : Open circuit potentials and electrochemical kinetics

The electrochemical behaviour of copper anodes in aqueous thiourea (TU)-containing sulphuric acid was followed from open circuit potential measurements, voltammetry and rotating disk and ring-disk electrode data. The open circuit potential of copper is controlled by equilibria involving different Cu...

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Detalles Bibliográficos
Autores principales: Bolzán, Agustín E., Wakenge, I. B., Piatti, Roberto C. V., Salvarezza, Roberto Carlos, Arvia, Alejandro Jorge
Formato: Articulo
Lenguaje:Inglés
Publicado: 2001
Materias:
Ciencias Exactas
Química
Cobre
Ácidos Sulfúricos
Electroquímica
Cinética química
Tiourea
Electrólitos
Acceso en línea:http://sedici.unlp.edu.ar/handle/10915/82672
Aporte de:
SEDICI (UNLP) de Universidad Nacional de La Plata
id I19-R120-10915-82672
record_format dspace
institution Universidad Nacional de La Plata
institution_str I-19
repository_str R-120
collection SEDICI (UNLP)
language Inglés
topic Ciencias Exactas
Química
Cobre
Ácidos Sulfúricos
Electroquímica
Cinética química
Tiourea
Electrólitos
spellingShingle Ciencias Exactas
Química
Cobre
Ácidos Sulfúricos
Electroquímica
Cinética química
Tiourea
Electrólitos
Bolzán, Agustín E.
Wakenge, I. B.
Piatti, Roberto C. V.
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
The behaviour of copper anodes in aqueous thiourea-containing sulphuric acid solutions : Open circuit potentials and electrochemical kinetics
topic_facet Ciencias Exactas
Química
Cobre
Ácidos Sulfúricos
Electroquímica
Cinética química
Tiourea
Electrólitos
description The electrochemical behaviour of copper anodes in aqueous thiourea (TU)-containing sulphuric acid was followed from open circuit potential measurements, voltammetry and rotating disk and ring-disk electrode data. The open circuit potential of copper is controlled by equilibria involving different Cu(I)–TU complex species. The thiourea electro-oxidation which yields formamidine disulphide and Cu(I)–TU complex species can be described as a process under intermediate kinetics taking place on a partially blocked copper anode. The degree of copper surface coverage and the type of predominant adsorbate depend on the concentration of thiourea and applied electric potential. Depending on the potential range adsorbates can be formed directly from either a strong TU–copper interaction or a relatively weaker formamidine disulphide interaction. The passivating layer can be related to the formation of polymer-like Cu(I)–TU layers and residues resulting both from thiourea and formamidine disulphide electro-oxidation. A previously proposed complex reaction pathway can explain the general behaviour of these systems, including adsorbate formation and the influence of the electrolyte solution constituents.
format Articulo
Articulo
author Bolzán, Agustín E.
Wakenge, I. B.
Piatti, Roberto C. V.
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author_facet Bolzán, Agustín E.
Wakenge, I. B.
Piatti, Roberto C. V.
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author_sort Bolzán, Agustín E.
title The behaviour of copper anodes in aqueous thiourea-containing sulphuric acid solutions : Open circuit potentials and electrochemical kinetics
title_short The behaviour of copper anodes in aqueous thiourea-containing sulphuric acid solutions : Open circuit potentials and electrochemical kinetics
title_full The behaviour of copper anodes in aqueous thiourea-containing sulphuric acid solutions : Open circuit potentials and electrochemical kinetics
title_fullStr The behaviour of copper anodes in aqueous thiourea-containing sulphuric acid solutions : Open circuit potentials and electrochemical kinetics
title_full_unstemmed The behaviour of copper anodes in aqueous thiourea-containing sulphuric acid solutions : Open circuit potentials and electrochemical kinetics
title_sort behaviour of copper anodes in aqueous thiourea-containing sulphuric acid solutions : open circuit potentials and electrochemical kinetics
publishDate 2001
url http://sedici.unlp.edu.ar/handle/10915/82672
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