Copper electrodeposition from an acidic plating bath containing accelerating and inhibiting organic additives
Copper electrodeposition on copper from still plating solutions of different compositions was investi- gated utilising electrochemical impedance spectroscopy (EIS), cyclic voltammetry, and scanning electron microscopy (SEM). An acid copper sulphate plating base solution was employed either with or w...
Guardado en:
| Autores principales: | Pasquale, Miguel Ángel, Gassa, Liliana Mabel, Arvia, Alejandro Jorge |
|---|---|
| Formato: | Articulo |
| Lenguaje: | Inglés |
| Publicado: |
2008
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| Materias: | |
| Acceso en línea: | http://sedici.unlp.edu.ar/handle/10915/79743 |
| Aporte de: |
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