Copper electrodeposition from an acidic plating bath containing accelerating and inhibiting organic additives

Copper electrodeposition on copper from still plating solutions of different compositions was investi- gated utilising electrochemical impedance spectroscopy (EIS), cyclic voltammetry, and scanning electron microscopy (SEM). An acid copper sulphate plating base solution was employed either with or w...

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Autores principales:	Pasquale, Miguel Ángel, Gassa, Liliana Mabel, Arvia, Alejandro Jorge
Formato:	Articulo
Lenguaje:	Inglés
Publicado:	2008
Materias:	Ciencias Exactas Química Cobre electrodeposition electrochemical impedance spectroscopy scanning electron microscopy Sulfato de Cobre polyethylene glycol
Acceso en línea:	http://sedici.unlp.edu.ar/handle/10915/79743
Aporte de:	SEDICI (UNLP) de Universidad Nacional de La Plata

id	I19-R120-10915-79743
record_format	dspace
institution	Universidad Nacional de La Plata
institution_str	I-19
repository_str	R-120
collection	SEDICI (UNLP)
language	Inglés
topic	Ciencias Exactas Química Cobre electrodeposition electrochemical impedance spectroscopy scanning electron microscopy Sulfato de Cobre polyethylene glycol
spellingShingle	Ciencias Exactas Química Cobre electrodeposition electrochemical impedance spectroscopy scanning electron microscopy Sulfato de Cobre polyethylene glycol Pasquale, Miguel Ángel Gassa, Liliana Mabel Arvia, Alejandro Jorge Copper electrodeposition from an acidic plating bath containing accelerating and inhibiting organic additives
topic_facet	Ciencias Exactas Química Cobre electrodeposition electrochemical impedance spectroscopy scanning electron microscopy Sulfato de Cobre polyethylene glycol
description	Copper electrodeposition on copper from still plating solutions of different compositions was investi- gated utilising electrochemical impedance spectroscopy (EIS), cyclic voltammetry, and scanning electron microscopy (SEM). An acid copper sulphate plating base solution was employed either with or without sodium chloride in the presence of a single additive, either polyethylene glycol (PEG) or 3-mercapto-2- propanesulphonic acid (MPSA), and their mixture. Thallium underpotential deposition/anodic stripping was employed to determine the adsorption capability of additives on copper. In the absence of chloride ions, MPSA shows a moderate adsorption on copper, whereas PEG is slightly adsorbed. At low cathodic overpotentials, the simultaneous presence of MPSA and chloride ions accelerates copper electrodeposition through the formation of an MPSA-chloride ion complex in the solution, particularly for about 220 mM sodium chloride. The reverse effect occurs in PEG-sodium chloride plating solutions. In this case, from EIS data the formation of a film that interferes with copper electrodeposition can be inferred. At higher cathodic overpotentials, when copper electrodeposition is under mass transport control, the cathode coverage by a PEG-copper chloride-mediated film becomes either partially or completely detached as the concentration of chloride ions at the negatively charged copper surface diminishes. The copper cathode grain topography at the mm scale depends on the cathodic overpotential, plating solution composition and average current density. Available data about the solution constituents and their adsorption on copper make it possible to propose a likely complex mechanism to understand copper electrodeposition from these media, including the accelerating effect of MPSA and the dynamics of PEG-copper chloride complex adsorbate interfering with the surface mobility of depositing copper ad-ions/ad-atoms.
format	Articulo Articulo
author	Pasquale, Miguel Ángel Gassa, Liliana Mabel Arvia, Alejandro Jorge
author_facet	Pasquale, Miguel Ángel Gassa, Liliana Mabel Arvia, Alejandro Jorge
author_sort	Pasquale, Miguel Ángel
title	Copper electrodeposition from an acidic plating bath containing accelerating and inhibiting organic additives
title_short	Copper electrodeposition from an acidic plating bath containing accelerating and inhibiting organic additives
title_full	Copper electrodeposition from an acidic plating bath containing accelerating and inhibiting organic additives
title_fullStr	Copper electrodeposition from an acidic plating bath containing accelerating and inhibiting organic additives
title_full_unstemmed	Copper electrodeposition from an acidic plating bath containing accelerating and inhibiting organic additives
title_sort	copper electrodeposition from an acidic plating bath containing accelerating and inhibiting organic additives
publishDate	2008
url	http://sedici.unlp.edu.ar/handle/10915/79743
work_keys_str_mv	AT pasqualemiguelangel copperelectrodepositionfromanacidicplatingbathcontainingacceleratingandinhibitingorganicadditives AT gassalilianamabel copperelectrodepositionfromanacidicplatingbathcontainingacceleratingandinhibitingorganicadditives AT arviaalejandrojorge copperelectrodepositionfromanacidicplatingbathcontainingacceleratingandinhibitingorganicadditives
bdutipo_str	Repositorios
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Copper electrodeposition from an acidic plating bath containing accelerating and inhibiting organic additives

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