Cita APA (7a ed.)

Pasquale, M. Á., Gassa, L. M., & Arvia, A. J. (2008). Copper electrodeposition from an acidic plating bath containing accelerating and inhibiting organic additives.

Cita Chicago Style (17a ed.)

Pasquale, Miguel Ángel, Liliana Mabel Gassa, y Alejandro Jorge Arvia. Copper Electrodeposition from an Acidic Plating Bath Containing Accelerating and Inhibiting Organic Additives. 2008.

Cita MLA (8a ed.)

Pasquale, Miguel Ángel, et al. Copper Electrodeposition from an Acidic Plating Bath Containing Accelerating and Inhibiting Organic Additives. 2008.