Electrochemical Characterization of a Cu(II)-Glutamate Alkaline Solution for Copper Electrodeposition

In this study, a cyanide-free electrolyte containing glutamate as a complexing agent is investigated as a more environmentally friendly alternative for alkaline copper plating. The solution was prepared using copper sulfate, sodium glutamate and potassium hydroxide. The pH of the electrolyte (pH = 8...

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Autores principales: Pary, Paola, Bengoa, Leandro Nicolás, Egli, Walter Alfredo
Formato: Articulo
Lenguaje:Inglés
Publicado: 2015
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Acceso en línea:http://sedici.unlp.edu.ar/handle/10915/154167
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spelling I19-R120-10915-1541672023-06-09T20:08:22Z http://sedici.unlp.edu.ar/handle/10915/154167 issn:0013-4651 Electrochemical Characterization of a Cu(II)-Glutamate Alkaline Solution for Copper Electrodeposition Pary, Paola Bengoa, Leandro Nicolás Egli, Walter Alfredo 2015 2023-06-09T13:14:47Z en Ingeniería Química Glutamate Alkaline Copper Electrodeposition Cu(II) In this study, a cyanide-free electrolyte containing glutamate as a complexing agent is investigated as a more environmentally friendly alternative for alkaline copper plating. The solution was prepared using copper sulfate, sodium glutamate and potassium hydroxide. The pH of the electrolyte (pH = 8) and the ratio ligand:copper (R = 3), were chosen from equilibrium diagrams in order to avoid the formation of insoluble complexes and oxides. The electrochemical response of the system was determined by means of cyclic voltammetry. The results showed that copper electroreduction occurs in a two steps pathway with a cuprous-glutamate complex as an intermediate. Galvanostatic deposits obtained from the bath under study had proper brightness and roughness at the selected current density conditions. Scanning electron microscopy and X-Ray diffraction were carried out in order to characterize deposits surface morphology and crystal orientation. Chronoamperometric experiments together with atomic force microscopy proved that copper deposits grow through an instantaneous nucleation mechanism in which nuclei are not exactly spherical. These preliminary studies suggest that the Cu+2-glutamate electrolyte may be suitable for the replacement of cyanide baths in copper lectrodeposition at high pH without the need of additives as this electrolyte acts as a self-levelling system. Also, the use of this electrolyte could eliminate the need of performing strike deposits on less noble substrates, allowing a one step plating process. Centro de Investigación y Desarrollo en Tecnología de Pinturas Articulo Articulo http://creativecommons.org/licenses/by/4.0/ Creative Commons Attribution 4.0 International (CC BY 4.0) application/pdf D275-D282
institution Universidad Nacional de La Plata
institution_str I-19
repository_str R-120
collection SEDICI (UNLP)
language Inglés
topic Ingeniería Química
Glutamate Alkaline
Copper
Electrodeposition
Cu(II)
spellingShingle Ingeniería Química
Glutamate Alkaline
Copper
Electrodeposition
Cu(II)
Pary, Paola
Bengoa, Leandro Nicolás
Egli, Walter Alfredo
Electrochemical Characterization of a Cu(II)-Glutamate Alkaline Solution for Copper Electrodeposition
topic_facet Ingeniería Química
Glutamate Alkaline
Copper
Electrodeposition
Cu(II)
description In this study, a cyanide-free electrolyte containing glutamate as a complexing agent is investigated as a more environmentally friendly alternative for alkaline copper plating. The solution was prepared using copper sulfate, sodium glutamate and potassium hydroxide. The pH of the electrolyte (pH = 8) and the ratio ligand:copper (R = 3), were chosen from equilibrium diagrams in order to avoid the formation of insoluble complexes and oxides. The electrochemical response of the system was determined by means of cyclic voltammetry. The results showed that copper electroreduction occurs in a two steps pathway with a cuprous-glutamate complex as an intermediate. Galvanostatic deposits obtained from the bath under study had proper brightness and roughness at the selected current density conditions. Scanning electron microscopy and X-Ray diffraction were carried out in order to characterize deposits surface morphology and crystal orientation. Chronoamperometric experiments together with atomic force microscopy proved that copper deposits grow through an instantaneous nucleation mechanism in which nuclei are not exactly spherical. These preliminary studies suggest that the Cu+2-glutamate electrolyte may be suitable for the replacement of cyanide baths in copper lectrodeposition at high pH without the need of additives as this electrolyte acts as a self-levelling system. Also, the use of this electrolyte could eliminate the need of performing strike deposits on less noble substrates, allowing a one step plating process.
format Articulo
Articulo
author Pary, Paola
Bengoa, Leandro Nicolás
Egli, Walter Alfredo
author_facet Pary, Paola
Bengoa, Leandro Nicolás
Egli, Walter Alfredo
author_sort Pary, Paola
title Electrochemical Characterization of a Cu(II)-Glutamate Alkaline Solution for Copper Electrodeposition
title_short Electrochemical Characterization of a Cu(II)-Glutamate Alkaline Solution for Copper Electrodeposition
title_full Electrochemical Characterization of a Cu(II)-Glutamate Alkaline Solution for Copper Electrodeposition
title_fullStr Electrochemical Characterization of a Cu(II)-Glutamate Alkaline Solution for Copper Electrodeposition
title_full_unstemmed Electrochemical Characterization of a Cu(II)-Glutamate Alkaline Solution for Copper Electrodeposition
title_sort electrochemical characterization of a cu(ii)-glutamate alkaline solution for copper electrodeposition
publishDate 2015
url http://sedici.unlp.edu.ar/handle/10915/154167
work_keys_str_mv AT parypaola electrochemicalcharacterizationofacuiiglutamatealkalinesolutionforcopperelectrodeposition
AT bengoaleandronicolas electrochemicalcharacterizationofacuiiglutamatealkalinesolutionforcopperelectrodeposition
AT egliwalteralfredo electrochemicalcharacterizationofacuiiglutamatealkalinesolutionforcopperelectrodeposition
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