Evolution of the Growth Front for Copper Electrodeposition Followed by Real Time Imaging

The interface motion for Cu electrodeposition in additive-free and thiourea-containing acid plating baths using three-dimensional and quasi-two-dimensional electrochemical cells was followed in real time in the potential range where the kinetics of the reaction is dominated by activation and Ohmic o...

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Autores principales: Schilardi, Patricia Laura, Méndez, Sandra, Salvarezza, Roberto Carlos, Arvia, Alejandro Jorge
Formato: Articulo
Lenguaje:Inglés
Publicado: 1998
Materias:
Ciencias Exactas
Química
Interfaces
Electrodes
Electrochemical cells
Electrodeposition
Polarization
Acceso en línea:http://sedici.unlp.edu.ar/handle/10915/120859
https://pubs.acs.org/doi/10.1021/la971358k
Aporte de:
SEDICI (UNLP) de Universidad Nacional de La Plata
id I19-R120-10915-120859
record_format dspace
institution Universidad Nacional de La Plata
institution_str I-19
repository_str R-120
collection SEDICI (UNLP)
language Inglés
topic Ciencias Exactas
Química
Interfaces
Electrodes
Electrochemical cells
Electrodeposition
Polarization
spellingShingle Ciencias Exactas
Química
Interfaces
Electrodes
Electrochemical cells
Electrodeposition
Polarization
Schilardi, Patricia Laura
Méndez, Sandra
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
Evolution of the Growth Front for Copper Electrodeposition Followed by Real Time Imaging
topic_facet Ciencias Exactas
Química
Interfaces
Electrodes
Electrochemical cells
Electrodeposition
Polarization
description The interface motion for Cu electrodeposition in additive-free and thiourea-containing acid plating baths using three-dimensional and quasi-two-dimensional electrochemical cells was followed in real time in the potential range where the kinetics of the reaction is dominated by activation and Ohmic overpotentials. In the additive-free plating bath the growing interface changes from a marginally stable (nodular) to an unstable (branched) regime as the activation overpotential/Ohmic overpotential ratio decreases. The presence of thiourea drives the interface motion to a steady-state regime in which the predictions of the Edwards−Wilkinson equation for the interface motion are obeyed. The influence of thiourea on Cu electrodeposition is to slow the growth rate at protrusions and to increase the growth rate at flat surface domains or valleys, leading to a smoothing of the entire growing electrodeposit surface.
format Articulo
Articulo
author Schilardi, Patricia Laura
Méndez, Sandra
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author_facet Schilardi, Patricia Laura
Méndez, Sandra
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author_sort Schilardi, Patricia Laura
title Evolution of the Growth Front for Copper Electrodeposition Followed by Real Time Imaging
title_short Evolution of the Growth Front for Copper Electrodeposition Followed by Real Time Imaging
title_full Evolution of the Growth Front for Copper Electrodeposition Followed by Real Time Imaging
title_fullStr Evolution of the Growth Front for Copper Electrodeposition Followed by Real Time Imaging
title_full_unstemmed Evolution of the Growth Front for Copper Electrodeposition Followed by Real Time Imaging
title_sort evolution of the growth front for copper electrodeposition followed by real time imaging
publishDate 1998
url http://sedici.unlp.edu.ar/handle/10915/120859
https://pubs.acs.org/doi/10.1021/la971358k
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