Electrochemical behaviour of copper in potassium thiocyanate : I. Dissolution, passivation and pitting processes

The electrochemical behaviour of copper in borate buffers containing KSCN is studied by potentiostatic and potentiodynamic techniques complemented with scanning electron microscopy and EDAX. The voltammetric response can be divided into three regions. Region I is related to the formation of a Cu(SCN...

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Autores principales: Figueroa, M. G., Salvarezza, Roberto Carlos, Arvia, Alejandro Jorge
Formato: Articulo
Lenguaje:Inglés
Publicado: 1986
Materias:
Ciencias Exactas
Química
Copper
Potassium thiocyanate
Electrochemical behaviour
Acceso en línea:http://sedici.unlp.edu.ar/handle/10915/119427
Aporte de:
SEDICI (UNLP) de Universidad Nacional de La Plata
id I19-R120-10915-119427
record_format dspace
institution Universidad Nacional de La Plata
institution_str I-19
repository_str R-120
collection SEDICI (UNLP)
language Inglés
topic Ciencias Exactas
Química
Copper
Potassium thiocyanate
Electrochemical behaviour
spellingShingle Ciencias Exactas
Química
Copper
Potassium thiocyanate
Electrochemical behaviour
Figueroa, M. G.
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
Electrochemical behaviour of copper in potassium thiocyanate : I. Dissolution, passivation and pitting processes
topic_facet Ciencias Exactas
Química
Copper
Potassium thiocyanate
Electrochemical behaviour
description The electrochemical behaviour of copper in borate buffers containing KSCN is studied by potentiostatic and potentiodynamic techniques complemented with scanning electron microscopy and EDAX. The voltammetric response can be divided into three regions. Region I is related to the formation of a Cu(SCN)<sub>ad</sub> monolayer followed by a porous tridimensional growth of CuSCN(s). A complex oxide layer containing a Cu(I) inner and a Cu(II) outer layer is formed under the CuSCN layer leading to metal passivation. At this stage of the process soluble Cu(I) and Cu(II) species are detected. Region II corresponds to the onset of Cu passivity through the formation of a complex film. The passive region extends up to a certain critical value (breakdown potential) associated with the localized corrosion of base Cu (region III). The breakdown potential decreases linearly as the KSCN concentration increases. The localized corrosion process is apparently related to the nucleation and growth of an unstable Cu(SCN)<sub>2</sub> layer in equilibrium with Cu(SCN)−<sub>3</sub>(I). A reaction pathway is presented to account for the overall electrochemical behaviour of Cu in borate buffers containing KSCN.
format Articulo
Articulo
author Figueroa, M. G.
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author_facet Figueroa, M. G.
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author_sort Figueroa, M. G.
title Electrochemical behaviour of copper in potassium thiocyanate : I. Dissolution, passivation and pitting processes
title_short Electrochemical behaviour of copper in potassium thiocyanate : I. Dissolution, passivation and pitting processes
title_full Electrochemical behaviour of copper in potassium thiocyanate : I. Dissolution, passivation and pitting processes
title_fullStr Electrochemical behaviour of copper in potassium thiocyanate : I. Dissolution, passivation and pitting processes
title_full_unstemmed Electrochemical behaviour of copper in potassium thiocyanate : I. Dissolution, passivation and pitting processes
title_sort electrochemical behaviour of copper in potassium thiocyanate : i. dissolution, passivation and pitting processes
publishDate 1986
url http://sedici.unlp.edu.ar/handle/10915/119427
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AT arviaalejandrojorge electrochemicalbehaviourofcopperinpotassiumthiocyanateidissolutionpassivationandpittingprocesses
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