Anodisation of copper in thiourea- and formamidine disulphide-containing acid solution : Part I. Identification of products and reaction pathway

The anodic behaviour of copper in aqueous 0.5 M sulphuric acid containing different amounts of dissolved thiourea or formamidine disulphide was investigated at 298 K, combining data from electrochemical polarisation, chemical analysis, UV–vis spectroscopy, XPS and EDAX analysis, and structural infor...

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Detalles Bibliográficos
Autores principales:	Bolzán, Agustín Eduardo, Haseeb, A. S. M. A., Schilardi, Patricia Laura, Piatti, Roberto C. V., Salvarezza, Roberto Carlos, Arvia, Alejandro Jorge
Formato:	Articulo
Lenguaje:	Inglés
Publicado:	2001
Materias:	Ciencias Exactas Química Anodic copper dissolution Thiourea Corrosion inhibitor
Acceso en línea:	http://sedici.unlp.edu.ar/handle/10915/118899
Aporte de:	SEDICI (UNLP) de Universidad Nacional de La Plata

id	I19-R120-10915-118899
record_format	dspace
institution	Universidad Nacional de La Plata
institution_str	I-19
repository_str	R-120
collection	SEDICI (UNLP)
language	Inglés
topic	Ciencias Exactas Química Anodic copper dissolution Thiourea Corrosion inhibitor
spellingShingle	Ciencias Exactas Química Anodic copper dissolution Thiourea Corrosion inhibitor Bolzán, Agustín Eduardo Haseeb, A. S. M. A. Schilardi, Patricia Laura Piatti, Roberto C. V. Salvarezza, Roberto Carlos Arvia, Alejandro Jorge Anodisation of copper in thiourea- and formamidine disulphide-containing acid solution : Part I. Identification of products and reaction pathway
topic_facet	Ciencias Exactas Química Anodic copper dissolution Thiourea Corrosion inhibitor
description	The anodic behaviour of copper in aqueous 0.5 M sulphuric acid containing different amounts of dissolved thiourea or formamidine disulphide was investigated at 298 K, combining data from electrochemical polarisation, chemical analysis, UV–vis spectroscopy, XPS and EDAX analysis, and structural information on copper–thiourea complexes. The main reactions depend on the applied potential and initial thiourea concentration. In the potential range −0.30≤E≤0.075 V (versus SCE), the electro-oxidation of thiourea to formamidine disulphide, the formation of Cu(I)–thiourea soluble complexes, and Cu(I)–thiourea complex polymer-like films, are the most relevant processes. The formation of this film depends on certain critical thiourea/copper ion molar concentration ratios at the reaction interface. At low positive potentials, the former reaction is under intermediate kinetic control, with the diffusion of thiourea from the solution playing a key role. For E≥0.075 V, soluble Cu(II) ions in the solution are formed and the anodic film is gradually changed to another one consisting of copper sulphide and residual copper. The new film assists the localised electrodissolution of copper. A complex reaction pathway for copper anodisation in these media for the low and high potential range is advanced.
format	Articulo Articulo
author	Bolzán, Agustín Eduardo Haseeb, A. S. M. A. Schilardi, Patricia Laura Piatti, Roberto C. V. Salvarezza, Roberto Carlos Arvia, Alejandro Jorge
author_facet	Bolzán, Agustín Eduardo Haseeb, A. S. M. A. Schilardi, Patricia Laura Piatti, Roberto C. V. Salvarezza, Roberto Carlos Arvia, Alejandro Jorge
author_sort	Bolzán, Agustín Eduardo
title	Anodisation of copper in thiourea- and formamidine disulphide-containing acid solution : Part I. Identification of products and reaction pathway
title_short	Anodisation of copper in thiourea- and formamidine disulphide-containing acid solution : Part I. Identification of products and reaction pathway
title_full	Anodisation of copper in thiourea- and formamidine disulphide-containing acid solution : Part I. Identification of products and reaction pathway
title_fullStr	Anodisation of copper in thiourea- and formamidine disulphide-containing acid solution : Part I. Identification of products and reaction pathway
title_full_unstemmed	Anodisation of copper in thiourea- and formamidine disulphide-containing acid solution : Part I. Identification of products and reaction pathway
title_sort	anodisation of copper in thiourea- and formamidine disulphide-containing acid solution : part i. identification of products and reaction pathway
publishDate	2001
url	http://sedici.unlp.edu.ar/handle/10915/118899
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Anodisation of copper in thiourea- and formamidine disulphide-containing acid solution : Part I. Identification of products and reaction pathway

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