Anodisation of copper in thiourea-containing acid solution : Part II. In situ transversal imaging observations. Kinetics of anodic film growth

The formation of anodic films during the anodisation of copper, at different applied potentials E, in aqueous 0.5 M sulphuric acid containing different amounts of dissolved thiourea was investigated following the corroding electrode profile by on line in situ imaging. For E<0.07 V (vs. SCE) the e...

Descripción completa

Guardado en:
Detalles Bibliográficos
Autores principales: Haseeb, A. S. M. A., Schilardi, Patricia Laura, Bolzán, Agustín Eduardo, Piatti, Roberto C. V., Salvarezza, Roberto Carlos, Arvia, Alejandro Jorge
Formato: Articulo
Lenguaje:Inglés
Publicado: 2001
Materias:
Ciencias Exactas
Química
Anodic copper dissolution
Thiourea
Corrosion inhibitor
Acceso en línea:http://sedici.unlp.edu.ar/handle/10915/118894
Aporte de:
SEDICI (UNLP) de Universidad Nacional de La Plata
id I19-R120-10915-118894
record_format dspace
institution Universidad Nacional de La Plata
institution_str I-19
repository_str R-120
collection SEDICI (UNLP)
language Inglés
topic Ciencias Exactas
Química
Anodic copper dissolution
Thiourea
Corrosion inhibitor
spellingShingle Ciencias Exactas
Química
Anodic copper dissolution
Thiourea
Corrosion inhibitor
Haseeb, A. S. M. A.
Schilardi, Patricia Laura
Bolzán, Agustín Eduardo
Piatti, Roberto C. V.
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
Anodisation of copper in thiourea-containing acid solution : Part II. In situ transversal imaging observations. Kinetics of anodic film growth
topic_facet Ciencias Exactas
Química
Anodic copper dissolution
Thiourea
Corrosion inhibitor
description The formation of anodic films during the anodisation of copper, at different applied potentials E, in aqueous 0.5 M sulphuric acid containing different amounts of dissolved thiourea was investigated following the corroding electrode profile by on line in situ imaging. For E<0.07 V (vs. SCE) the electro-oxidation of thiourea to formamidine disulphide and the electrodissolution of copper to Cu(I)–thiourea complexes, including the formation of a polymer-like Cu(I)–thiourea complex (film I), take place. For E>0.07 V, the main reactions are the electro-decomposition of formamidine disulphide and Cu(I)–thiourea complexes yielding a copper sulphide-containing film (film II) and the electrodissolution of copper as aqueous Cu(II) ions through film II. The relative contribution of these processes depends on thiourea concentration in the solution, the applied electric potential and anodisation time. The growth kinetics of films I and II were determined from the evolution of the average film height〈h〉obtained from in situ imaging. The kinetics of film I fit a parabolic rate law, whereas those of film II approach a linear〈h〉versus anodisation time relationship. The rupture of film II assists the localised corrosion of copper. Likely physical mechanisms for the formation of these anodic films are discussed.
format Articulo
Articulo
author Haseeb, A. S. M. A.
Schilardi, Patricia Laura
Bolzán, Agustín Eduardo
Piatti, Roberto C. V.
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author_facet Haseeb, A. S. M. A.
Schilardi, Patricia Laura
Bolzán, Agustín Eduardo
Piatti, Roberto C. V.
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author_sort Haseeb, A. S. M. A.
title Anodisation of copper in thiourea-containing acid solution : Part II. In situ transversal imaging observations. Kinetics of anodic film growth
title_short Anodisation of copper in thiourea-containing acid solution : Part II. In situ transversal imaging observations. Kinetics of anodic film growth
title_full Anodisation of copper in thiourea-containing acid solution : Part II. In situ transversal imaging observations. Kinetics of anodic film growth
title_fullStr Anodisation of copper in thiourea-containing acid solution : Part II. In situ transversal imaging observations. Kinetics of anodic film growth
title_full_unstemmed Anodisation of copper in thiourea-containing acid solution : Part II. In situ transversal imaging observations. Kinetics of anodic film growth
title_sort anodisation of copper in thiourea-containing acid solution : part ii. in situ transversal imaging observations. kinetics of anodic film growth
publishDate 2001
url http://sedici.unlp.edu.ar/handle/10915/118894
work_keys_str_mv AT haseebasma anodisationofcopperinthioureacontainingacidsolutionpartiiinsitutransversalimagingobservationskineticsofanodicfilmgrowth
AT schilardipatricialaura anodisationofcopperinthioureacontainingacidsolutionpartiiinsitutransversalimagingobservationskineticsofanodicfilmgrowth
AT bolzanagustineduardo anodisationofcopperinthioureacontainingacidsolutionpartiiinsitutransversalimagingobservationskineticsofanodicfilmgrowth
AT piattirobertocv anodisationofcopperinthioureacontainingacidsolutionpartiiinsitutransversalimagingobservationskineticsofanodicfilmgrowth
AT salvarezzarobertocarlos anodisationofcopperinthioureacontainingacidsolutionpartiiinsitutransversalimagingobservationskineticsofanodicfilmgrowth
AT arviaalejandrojorge anodisationofcopperinthioureacontainingacidsolutionpartiiinsitutransversalimagingobservationskineticsofanodicfilmgrowth
bdutipo_str Repositorios
_version_ 1764820447676858368

Ejemplares similares