The circuit designer's companion /
Una clase magistral en la optimizaión del diseño de circuitos electrónicos.
Guardado en:
| Autor principal: | |
|---|---|
| Formato: | Libro |
| Lenguaje: | Inglés |
| Publicado: |
Amsterdam :
Elsevier : Newnes,
2010.
|
| Edición: | 2nd. ed. |
| Materias: | |
| Aporte de: | Registro referencial: Solicitar el recurso aquí |
| LEADER | 02481nam a2200325a 44500 | ||
|---|---|---|---|
| 001 | UBP13910 | ||
| 003 | AR-CdUBP | ||
| 005 | 20220310161035.0 | ||
| 008 | 110414s2010 us a g 001 eng d | ||
| 020 | |a 978-0-7506-6370-0 | ||
| 040 | |a AR-CdUBP |b spa | ||
| 041 | |a eng | ||
| 100 | |a Williams, Tim | ||
| 245 | 1 | 4 | |a The circuit designer's companion / |c Tim Williams. |
| 250 | |a 2nd. ed. | ||
| 260 | |a Amsterdam : |b Elsevier : Newnes, |c 2010. | ||
| 300 | |a xi, 341 p. ; |c 24 cm. | ||
| 500 | |a La Biblioteca posee: 2 ej. | ||
| 504 | |a Bibliografía: p.329-331. | ||
| 505 | 0 | |a Chapter 1. Grounding and wiring. - 1.1. Grounding. - 1.2. Wiring and cables. - 1.3. Transmission lines. - Chapter 2. Printed circuits. - 2.1. Board types. - 2.2. Design rules. - 2.3. Board assembly: surface mount and throught hole. - 2.4. Surface protection. - 2.5. Sourcing boards and artwork. - Chapter 3. Passive components. - 3.1. Resistors. - 3.2. Potentiometers. - 3.3. Capacitors. - 3.4. Inductors. - 3.5. Crystals and resonators. - Chapter 4. Active components. - 4.1. Diodes. - 4.2. Thyristors and triacs. - 4.3. Bipolar transitors. - 4.4. Junction field effect transistors. - 4.5. MOSFETs. - 4.6. IGBTs. - Chapter 5. Analogue integrated circuits. - 5.1. The ideal op-amo. - 5.2. The practical op-amp. - 5.3. Comparators. -5.4. Voltage references, - 5.5. Circuits modelling. - Chapter 6. Digital circuits. - 6.1. Logic ICs. - 6.2. Interfacing. - 6.3. Using microcontrollers. - 6.4. Microporcessor watchdogs and supervision. - 6.5. Software protection techniques. - Chapter 7. Power supplies. - 7.1. General. - 7.2. Input and output parameters. - 7.3. Abnormal conditions. - 7.4. Mechanical requirements. - 7.5. Batteries. - Chapter 8. Electromagnetic compatibility, - 8.1. The need for EMC. - 8.2. EMC legislation and standards. - 8.3. Interference coupling mechanism. - 8.4. Circuit design and layout. - 8.5. Shielding. - 8.6. Filtering. - 8.7. Cables and connectors. - 8.8 EMC design checklist. - Chapter 9. General product design. - 9.1. Safety. - 9.2. Design for production. - 9.3. Testability. - 9.4. Reliability. - 9.5. Thermal management. | |
| 520 | |a Una clase magistral en la optimizaión del diseño de circuitos electrónicos. | ||
| 650 | 4 | |a ANALISIS DE CIRCUITOS | |
| 650 | 4 | |a CIRCUITOS ELECTRICOS | |
| 653 | |a TELECOMUNICACIONES | ||
| 930 | |a TELECOMUNICACIONES | ||
| 931 | |a 13910 |b UBP | ||
| 942 | |2 cdu |c BK | ||
| 945 | |a NNM | ||
| 984 | |a 621.3.049 |b W670c2 | ||
| 999 | |c 28914 |d 28914 | ||