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| LEADER |
01032nam a2200265a 44500 |
| 001 |
UBP06051 |
| 003 |
AR-CdUBP |
| 005 |
20220310153516.0 |
| 008 |
151212s2000#######|||||||||||||||||eng|d |
| 040 |
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|a AR-CdUBP
|b spa
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| 041 |
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|a eng
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| 110 |
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|a On Semiconductor
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| 245 |
1 |
0 |
|a Semiconductor packaging and outlines :
|b reference manual and design guide /
|c On Semiconductor.
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| 260 |
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|a Canada :
|b Semiconductor Components Industries,
|c 2000
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| 300 |
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|a 176 p. ;
|c 23 cm.
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| 500 |
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|a CASERM/D Rev. 0, Sep-2000
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| 505 |
0 |
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|a Section 1. Common package reference table. Section 2. Case outlines. Section 3. Thermal considerations. Section 4. Solderig / Mounting techniques. Section 5. Handling of semiconductor packages. Section 6. Semiconductor package quality and reliability. Appndix A. Applicable standards.
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| 650 |
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4 |
|a SEMICONDUCTORES
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| 653 |
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|a TELECOMUNICACIONES
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| 930 |
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|a TELECOMUNICACIONES
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| 931 |
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|a 06051
|b UBP
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| 942 |
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|2 cdu
|c BK
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| 945 |
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|a SMM
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| 984 |
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|a 621.315.049
|b On1se
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| 999 |
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|c 21587
|d 21587
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