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| LEADER |
00966pam#a2200253#a#4500 |
| 001 |
BCCAB012818 |
| 008 |
901218s1992####njua###f#b####001#0#eng## |
| 005 |
20081217145257.0 |
| 003 |
AR-BCCAB |
| 245 |
1 |
0 |
|a Handbook of sputter deposition technology :
|b principles, technology, and applications /
|c by Kiyotaka Wasa and Shigeru Hayakawa.
|
| 260 |
# |
# |
|a Park Ridge, N.J., U.S.A. :
|b Noyes Publications,
|c c1992.
|
| 300 |
# |
# |
|a xii, 304 p. :
|b il. ;
|c 24 cm.
|
| 490 |
1 |
# |
|a Materials science and process technology series
|
| 504 |
# |
# |
|a Incluye referencias bibliográficas e índice.
|
| 020 |
# |
# |
|a 0815512805
|
| 100 |
1 |
# |
|a Wasa, Kiyotaka.
|
| 700 |
1 |
# |
|a Hayakawa, Shigeru,
|d 1925-
|
| 080 |
# |
# |
|a 539.23
|
| 650 |
# |
0 |
|a Cathode sputtering (Plating process).
|
| 650 |
# |
0 |
|a Thin films.
|
| 040 |
# |
# |
|a DLC
|c DLC
|d DLC
|b spa
|d arbccab
|
| 856 |
4 |
2 |
|3 Reseña
|u http://www.loc.gov/catdir/description/wap041/90027820.html
|
| 942 |
# |
# |
|c BK
|
| 952 |
# |
# |
|2 udc
|a ARBCCAB
|b ARBCCAB
|i 15093
|o 539.23 W269
|p 15093
|t 1
|y BK
|