Dynamic scaling exponents of copper electrodeposits from scanning force microscopy imaging : Influence of a thiourea additive on the kinetics of roughening and brightening

Changes in the topography of Cu electrodeposits grown on polycrystalline Cu substrates at low constant current density from still aqueous concentrated CuSO<sub>4</sub> + H<sub>2</sub>SO<sub>4</sub> solutions, at 298 K, were studied by scanning force microscopy (SF...

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Detalles Bibliográficos
Autores principales:	Mendez, S., Andreasen, Gustavo, Schilardi, Patricia Laura, Figueroa, M., Vázquez, L., Salvarezza, Roberto Carlos, Arvia, Alejandro Jorge
Formato:	Articulo
Lenguaje:	Inglés
Publicado:	1998
Materias:	Ciencias Exactas Química electrodeposits Tiourea Topografía Cobre polycrystalline Cinética química
Acceso en línea:	http://sedici.unlp.edu.ar/handle/10915/80659
Aporte de:	SEDICI (UNLP) de Universidad Nacional de La Plata

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