Mendez, S., Andreasen, G., Schilardi, P. L., Figueroa, M., Vázquez, L., Salvarezza, R. C., & Arvia, A. J. (1998). Dynamic scaling exponents of copper electrodeposits from scanning force microscopy imaging: Influence of a thiourea additive on the kinetics of roughening and brightening.
Cita Chicago Style (17a ed.)Mendez, S., Gustavo Andreasen, Patricia Laura Schilardi, M. Figueroa, L. Vázquez, Roberto Carlos Salvarezza, y Alejandro Jorge Arvia. Dynamic Scaling Exponents of Copper Electrodeposits from Scanning Force Microscopy Imaging: Influence of a Thiourea Additive on the Kinetics of Roughening and Brightening. 1998.
Cita MLA (8a ed.)Mendez, S., et al. Dynamic Scaling Exponents of Copper Electrodeposits from Scanning Force Microscopy Imaging: Influence of a Thiourea Additive on the Kinetics of Roughening and Brightening. 1998.