Smoothening Mechanism of Thiourea on Silver Electrodeposition : Real Time Imaging of the Growth Front Evolution
Ag electrodeposits were grown on a polycrystalline Ag cathode at either 0.01 or 1 mA cm<sup>-2</sup> from aqueous 5 × 10<sup>-3</sup> M Ag<sub>2</sub>SO<sub>4</sub> + 10<sup>-2</sup> M H<sub>2</sub>SO<sub>4</sub> + 0...
Guardado en:
Autores principales: | Azzaroni, Omar, Schilardi, Patricia Laura, Salvarezza, Roberto Carlos, Arvia, Alejandro Jorge |
---|---|
Formato: | Articulo |
Lenguaje: | Inglés |
Publicado: |
1999
|
Materias: | |
Acceso en línea: | http://sedici.unlp.edu.ar/handle/10915/127440 https://pubs.acs.org/doi/abs/10.1021/la9806092 |
Aporte de: |
Ejemplares similares
-
Evolution of the Growth Front for Copper Electrodeposition Followed by Real Time Imaging
por: Schilardi, Patricia Laura, et al.
Publicado: (1998) -
Solution of the Stefan Problem: Silver Electrodeposition under Mass Transfer Control : The Transition from Diffusion to Advection Regime
por: Pasquale, Miguel Ángel, et al.
Publicado: (2004) -
Growth of three-dimensional silver fractal electrodeposits under damped free convection
por: Carro, P., et al.
Publicado: (1993) -
A comparative study of the early stages of mercury, cadmium, lead, silver and copper electrodeposition on columnar and smooth platinum electrodes
por: Martins, María Elisa, et al.
Publicado: (1996) -
Changes in the growth mode of electrodeposited silver layers : Surface rearrangements induced by the presence of lead adatoms
por: Carro, P., et al.
Publicado: (1991)