Electrical Design of Through Silicon Via

Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints...

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Detalles Bibliográficos
Otros Autores: Lee, Manho (ed.), Pak, Jun So (ed.), Kim, Joungho (ed.)
Formato: Libro electrónico
Lenguaje:Inglés
Publicado: Dordrecht : Springer Netherlands : Imprint: Springer, 2014.
Materias:
Special purpose computers.
Electronic circuits.
Engineering.
Circuits and Systems.
Electronic Circuits and Devices.
Acceso en línea:http://dx.doi.org/10.1007/978-94-017-9038-3
Aporte de:Registro referencial: Solicitar el recurso aquí
Bibliotecas (ING-UNLP) de Universidad Nacional de La Plata

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