Lee, M., Pak, J. S., & Kim, J. (2014). Electrical Design of Through Silicon Via. Springer Netherlands : Imprint: Springer.
Cita Chicago Style (17a ed.)Lee, Manho, Jun So Pak, y Joungho Kim. Electrical Design of Through Silicon Via. Dordrecht: Springer Netherlands : Imprint: Springer, 2014.
Cita MLA (8a ed.)Lee, Manho, et al. Electrical Design of Through Silicon Via. Springer Netherlands : Imprint: Springer, 2014.
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