Poly-SiGe for MEMS-above-CMOS Sensors
Polycrystalline SiGe has emerged as a promising MEMS (Microelectromechanical Systems) structural material since it provides the desired mechanical properties at lower temperatures compared to poly-Si, allowing the direct post-processing on top of CMOS. This CMOS-MEMS monolithic integration can lead...
Guardado en:
Autor principal: | |
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Otros Autores: | , |
Formato: | Libro electrónico |
Lenguaje: | Inglés |
Publicado: |
Dordrecht :
Springer Netherlands : Imprint: Springer,
2014.
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Colección: | Springer Series in Advanced Microelectronics,
44 |
Materias: | |
Acceso en línea: | http://dx.doi.org/10.1007/978-94-007-6799-7 |
Aporte de: | Registro referencial: Solicitar el recurso aquí |
Tabla de Contenidos:
- Acknowledgements
- Abstract
- Symbols and Abbreviations
- Introduction
- Poly-SiGe As Piezoresistive Material
- Design of a Poly-SiGe Piezoresistive Pressure Sensor
- The Pressure Sensor Fabrication Process
- Sealing of Surface Micromachined Poly-SiGe Cavities
- Characterization of Poly-SiGe pressure sensors
- CMOS Integrated Poly-SiGe Piezoresistive Pressure Sensor
- Conclusions And Future Work
- Appendix A
- Appendix B
- Appendix C
- Appendix D.