Copper Wire Bonding
This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Â Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high co...
Guardado en:
| Autor principal: | Chauhan, Preeti S. |
|---|---|
| Otros Autores: | Choubey, Anupam, Zhong, ZhaoWei, Pecht, Michael G. |
| Formato: | Libro electrónico |
| Lenguaje: | Inglés |
| Publicado: |
New York, NY :
Springer New York : Imprint: Springer,
2014.
|
| Materias: | |
| Acceso en línea: | http://dx.doi.org/10.1007/978-1-4614-5761-9 |
| Aporte de: | Registro referencial: Solicitar el recurso aquí |
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